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| SRFIC103T1资料 | |
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SRFIC103T1 PDF Download |
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File Size : 116 KB
Manufacturer: Description:These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：SRFIC103T1 厂 家： 封 装：SOT-343 批 号： 数 量：12000 说 明：绝对全新原装大量现货，质量保证，欢迎来电查询 |
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运 费： 所在地： 新旧程度： |
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| 联系人：李利媛 |
| 电 话：0755/83019596,83247541,83247486 |
| 手 机：13480648723 |
| QQ：1104562168,1178139673,1113496577,2881934444,2881943289,2881943290 |
| MSN：ao-liteng01@hotmail.com,ao-liteng02@hotmail.com,ao-liteng03@hotmail.com,ao-liteng04@hotmail.com |
| 传 真：0755-83016216 |
| EMail：aoliteng1@163.com |
| 公司地址： 广东省深圳市福田区振兴西路新欣大厦B座518室 |
