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SN74LV4053ARGYR资料 | |
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SN74LV4053ARGYR PDF Download |
File Size : 116 KB
Manufacturer:TI Description:Notes: 1. RJA is determined with the device mounted on a 1 in2 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. The thermal resistance from the junction to the circuit board side of the solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is defined as the top surface of the copper chip carrier. RJC and RJB are guaranteed by design while RJA is determined by the user's board design. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:SN74LV4053ARGYR 厂 家:TI 封 装:QFN16 批 号:09+ 数 量:30000 说 明:全新原装正品现货,专业供应 |
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