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| S80C196NU50资料 | |
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S80C196NU50 PDF Download |
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File Size : 116 KB
Manufacturer:intel Description:The solder pad for this package should be 0.210 inches square. Fill the pad with several plated-thru vias connecting the pad surface to the RF input and output ground planes. Insufficient grounding of the package base may cause the amplifier to oscillate or result in poor amplifier performance. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：S80C196NU50 厂 家：intel 封 装：QFP 批 号：09+ 数 量：30000 说 明：全新原装正品现货，专业供应 |
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