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| MC68HC705C8ACFNE资料 | |
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MC68HC705C8ACFNE PDF Download |
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File Size : 116 KB
Manufacturer:FREESCAL Description:1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MC68HC705C8ACFNE 厂 家：FREESCAL 封 装：05 06 批 号：09+ 数 量：30000 说 明：全新原装正品现货，专业供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：李利媛 |
| 电 话：0755/83019596,83247541,83247486 |
| 手 机：13480648723 |
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| 传 真：0755-83016216 |
| EMail：aoliteng1@163.com |
| 公司地址： 广东省深圳市福田区振兴西路新欣大厦B座518室 |
