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| MC14069UBCP资料 | |
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MC14069UBCP PDF Download |
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File Size : 116 KB
Manufacturer:MC Description: 32-Pin DAD TSSOP1.69See Note 1 (1) The MC14069UBCP package is thermally enhanced for conductive cooling using an exposed metal pad area. It is impractical to use the device with the pad exposed to ambient air as the only means for heat dissipation. For this reason, RJA, a system parameter that characterizes the thermal treatment, is provided in the Application Information section of the data sheet. An example and discussion of typical system RJA values are provided in the Thermal Information section. This example provides additional information regarding the power dissipation ratings. This example should be used as a reference to calculate the heat dissipation ratings for a specific application. TI application engineering provides technical support to design heatsinks if needed. Also, for additional general information on PowerPad packages, see TI document SLMA002. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MC14069UBCP 厂 家：MC 封 装：DIP 批 号：09+ 数 量：30000 说 明：全新原装正品现货，专业供应 |
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