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| LM95231BIMM-2资料 | |
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LM95231BIMM-2 PDF Download |
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File Size : 116 KB
Manufacturer:NSC Description: For more information on the PWP package, refer to TI technical brief, literature number SLMA002. Test board conditions: 1. 3 x 3, 4 layers, thickness: 0.062 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the 2 internal layers 5. 12 thermal vias (see Recommended Land Pattern in applications section of this data sheet) (3) Maximum power dissipation may be limited by over current protection. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：LM95231BIMM-2 厂 家：NSC 封 装：MSOP 8P 批 号：09+ 数 量：30000 说 明：全新原装正品现货，专业供应 |
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运 费： 所在地： 新旧程度： |
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