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HUF76609D3S资料 | |
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HUF76609D3S PDF Download |
File Size : 116 KB
Manufacturer:FAIRC Description:These devices do not normally require heat sinks, however, standard precautionary design and layout procedures should be used to ensure devices do not overheat. The ground and power planes beneath the package, as well as all pcb signal runs to and from the device, should be as heavy as possible to help conduct heat away from the package. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:HUF76609D3S 厂 家:FAIRC 封 装:2009+ 批 号:200000 数 量:TO-252(DPAK) 说 明:全新原装现货特价供应 欢迎来电查询 |
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运 费: 所在地: 新旧程度: |
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