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| EPM7064STC100-7N资料 | |
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EPM7064STC100-7N PDF Download |
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File Size : 116 KB
Manufacturer:ALTERA Description:† For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, JP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：EPM7064STC100-7N 厂 家：ALTERA 封 装：QFP 批 号：09+ 数 量：5000 说 明：绝对全新原装正品现货，欢迎新老客户来电！！ |
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