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CM3106-12SN

CM3106-12SN资料
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File Size : 116 KB Manufacturer:CALMICRO Description: ON Semiconductor has designed a new device in even smaller spaces with more functionality. The device is placed in a new package type, being made available and accepted by JEDEC, called the Fine Pitch Quad Flat No Lead package (QFN). The specification falls under JEDEC MOC220, dated January 2000. It calls for packages whose body sizes range from 3 x 3 mm to 8 x 8 mm. The lead count goes from 4 to 56. The thickness (height off the board) is a maximum of 1 mm. ON Semiconductor put a new device, called the NLAS44599, in a 3 x 3 package. The new device consists of 16 leads with a 0.5 mm pitch. Since the package is no lead, there are no coCplanarity issues and no solder bumps. The user simply applies solder paste to the circuit board, places the QFN, and uses IR reCflow soldering to complete the mounting. With this concept, we were able to put the equivalent of four of the NLAS4599 SPDT devices into a 9 mm2 package. Compared to the 4053 in TSSOP, this device is more than four times as space efficient. With 16 pins, we were able to construct two independent DPDT switches. These devices are inherently bilateral. Signals can flow in either direction and, once turned on, these devices offer almost zero propagation delay. See Figure 3 for an example of how to switch LVDS signals.

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型号：CM3106-12SN 厂家：CALMICRO 封装：sop8 批号：09+ 数量：30000 说明：全新原装正品现货，专业供应


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