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| BCM2050KML资料 | |
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BCM2050KML PDF Download |
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File Size : 116 KB
Manufacturer:BROADCOM Description:the heat to be removed in all directions. Via holes, necessary for RF grounding, should be filled with copper plating to further remove heat from the duplexers Tx filter and dump it into a second ground plane located in a lower layer of the motherboard. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：BCM2050KML 厂 家：BROADCOM 封 装：BGA 批 号：09+ 数 量：30000 说 明：全新原装正品现货，专业供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：李利媛 |
| 电 话：0755/83019596,83247541,83247486 |
| 手 机：13480648723 |
| QQ：1104562168,1178139673,1113496577,2881934444,2881943289,2881943290 |
| MSN：ao-liteng01@hotmail.com,ao-liteng02@hotmail.com,ao-liteng03@hotmail.com,ao-liteng04@hotmail.com |
| 传 真：0755-83016216 |
| EMail：aoliteng1@163.com |
| 公司地址： 广东省深圳市福田区振兴西路新欣大厦B座518室 |
技术支持:维库电子市场网